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NXP Announces Production of Security Chips in the US

Multimillion-dollar expansion program will complete the re-shoring of an end-to-end US supply chain.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the US, enabling the company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs.
 
Upon completion of the expansion project, NXP facilities in Austin and Chandler will be certified to manufacture finished products that exceed the highest domestic and international security and quality standards.
 
“This initiative advances NXP’s long-term commitment to developing secure ID solutions for federal, state and local government programs in the US and demonstrates our deep dedication to serving the American market,” said Ruediger Stroh, EVP of security and connectivity at NXP. “The expansion program further positions NXP to deliver solutions for the IoT, connected devices and many other fast-growing applications in the US as we continue to be a major contributor to the country’s global leadership in the semiconductor industry.”
 
NXP’s technology is included in core components that power secure government-issued ID documents in more than 120 countries, and is used by 95 countries worldwide to secure electronic passport programs.

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